SINGLE AND DOUBLE FACE

Materials: CEM1, CEM3, FR4, Kapton, Teflon
Laminate base thickness: da 0.4 a 3.2 mm
Copper base thickness: da 17.5 μm a 200 μm
Surface finishes: Passivated copper, Chemical tin, HAL-LF, Chemical gilding,
Electrolytic gilding, Chemical silver

MULTILAYER

Maximum number of layers: 24
Minimum hole: 0.1 mm
Minimum track: 12 μm
Surface finishes: Passivated copper, Chemical tin, HAL-LF,
Chemical gilding, Electrolytic gilding, Chemical silver

FLEXIBLE AND RIGID FLEXIBLE

Materials: FR4, Kapton, Polymide
Flexible base thickness: 0.1mm minimo | Rame base: 17.5, 35, 70 µm
FR4 thickness: da 0.4 mm | Spessore rame FR4: da 17.5 µm
Finishes: Passivated copper, Chemical tin, Chemical silver,
Chemical gilding

ALUMINIUM

Materials to be used: IMS Monolayer e Bilayer
Metal thickness: 1.0 – 1.5 – 2.0 – 3.0 mm
Insulation thickness: 0.1 – 0.2 – 0.25 mm
Copper base thickness: 17.5, 35,70, 105, 140, 170, 200 µm
Surface finishes: Passivated copper, Electrolytic gilding, HAL-LF,
Chemical Gold/Silver/Tin

Technical specifications in DOWNLOAD AREA >