Layers count | 1-24 layers |
Finished Board Thickness | 0.003”- 0.16” (0.075mm - 6.0mm) |
Max. panel size | > 600×500mm |
Available Laminates Material | FR4, CEM1, CEM3, ALUMINIUM, Polymide , Polyester |
Finished board Thickness tolerance | STD 1,6 ±10% |
Finished hole diameter (Min) | CNC 0.12mm, LASER 0.10mm |
Finished hole diameter (Max) | 6.0mm |
Hole diameter tolerance (NPTH) | ± 1mil (±0.05mm) |
Hole diameter tolerance (PTH) | ± 2mil (± 0.076mm ) |
Copper foil thickness | 12μm, 18μm, 35μm, 70μm, 105μm, > 130μm |
Layer design line width/spacing (Min) (1/3 OZ) | ≥ 0.075mm (3mil) |
Layer design line width/spacing (Min) (1 OZ) | ≥ 0.100mm (4mil) |
Surface Finished (lead free) | OSP, Immersion Gold, Gold Fingers, HAL, Tin and SILVER plating |
Ni thickness under gold | ≥ 3μm min IPC-4552 |
Au thickness | 0,05μm min IPC-4552 |
Immersion Tin | 0.7~1.2μm IPC-4554 |
OSP | 0.2-0.5μm |
Drill hole true position tolerance | ± 0.05mm |
Punching die dimension tolerance (Exact die) | ± 0.05mm |
Punching die dimension tolerance (edge to edge) | ± 0.05mm |
LDI Tecnology (Laser Direct Imaging) High Volume | = 25μm for HDI Flex and Rigid Flex |
Major Laminate HIGH CTI, HIGH TG | ShengYi, Doosan, Kingboard |
VIA in PAD ASSEMBLY TECHNOLOGY | Plated Over Filled Vias, IPC4761 Type VII |
SBU-Sequential Build_up, Vias Buried and Capped | |
Holes Via Laser | diam < 150 μm/6mils and Pads diam < 400 μm/16mils |
Major Laminate HIGH CTI, HIGH TG | ShengYi, Doosan, Kingboard |